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Brewer Science Introduces Thin Wafer Handling Systems for Compound Semiconductor Device Processing

Suitable for low-volume prototype processing that enables transfer to high-volume manufacturing

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Brewer Science, Inc., introduced new wafer processing equipment designed for thin wafer separation and post-debonding cleaning, steps that are critical for ultrasensitive compound semiconductor (CS) device processing. These latest equipment designs enable thin wafer handling technologies that can broaden the process window and lower total cost of ownership by reducing yield loss and increasing throughput.

“Brewer Science Cee lab-scale processing equipment offers track-quality precision and is suitable for low-volume prototype processing that enables transfer to high-volume manufacturing,” says Wayne Farrar, director of equipment. “No other company is as uniquely positioned as Brewer Science to offer complete solutions for your thin wafer handling needs. With our temporary bonding materials and lab-scale equipment, we bring a breadth and depth of process experience that is unequaled by any other company.”

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